GENITEC DONGGUAN CO.,LTD
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Industrial 355nm PCB V Cut Machine FPC UV Laser Cutter For Glass
Industrial Laser Cutting Machine and Laser Cutting Equipment for PCB ZMLS5000DP
PCB V Cut Machine Description:
1. PCB V Cut Machine is with control software with independent intellectual property rights, user-friendly interface, complete functions, simple operation;
2. can process any graphics, cutting different thicknesses and different materials can be processed and the synchronization is complete hierarchical; optical system design optimization to ensure high beam quality, reduce the focused spot size, to ensure precision;
3. using high-performance UV laser with wave length, high beam quality, higher peak power characteristics. Due to ultraviolet light through decomposition, vaporization rather than melting materials processing to achieve, so almost no post-processing glitches, small thermal effect, no points
Layer, the effect of cutting precision, smooth, steep sidewalls.
4. using vacuum fixed sample, no mold protection plate is fixed, convenient, improve processing efficiency.
5. can cut a variety of substrate materials, such as: silicon, ceramic, glass and the like.
6. automatic correction, automatic positioning function, multi-plate cutting, automatic thickness measurement and compensation, motor Bank and compensation, working better uniformity and small machining depth fluctuations, higher processing efficiency of complex graphics.
FPC UV laser cutting machine, FPC laser cutting machine Technical parameters:
Solid-state UV laser source laser wavelength: 355nm
High performance laser: the use of international first-line brand solid-state ultraviolet laser/green laser, with good beam quality, focusing spot small, power distribution uniform, small thermal effect, slit width small, cutting quality high advantages is the guarantee of perfect cutting quality.
Fast and high precision: the combination of high precision, low drift vibroscope and fast coreless linear motor system enables fast cutting while maintaining high precision on the micron scale.
| Item | ZMLS5000DP |
|---|---|
| Machine size(L*W*H) | 1680*1650*1800mm |
| Weight | 2000KG |
| Power supply | Single Phase AC220V/3KW |
| Laser source | PS Laser/NS Laser |
| Laser power | 15W/20W (Optional) |
| Material thickness | ≦1.6mm (According to material) |
| Whole machine precision | ±20 μm |
| positioning precision | ±2 μm |
| Repeat precision | ±2 μm |
| Processing size | 350mm*450mm*2 |
| Focus spot diameter | 20 ± 5 μm |
| Environment temperature/humidity | 20±2 °C/<60% |
| Machine tool body | Marble |
| Galvanometer system | Original imported |
| Motion controlling system | Original imported |
| Formats | Gerber,DXF, ASCII, Excellon I and II, sieb&Meier |
| Necessary hardware and software | Including PC and CAM software |
| Working mode | Manual loading and unloading |